MIL-DTL-47113D, DETAIL SPECIFICATION: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE (25 SEP 2001) [SUPERSEDING MIL-C-47113B]

MIL-DTL-47113D, DETAIL SPECIFICATION: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE (25 SEP 2001) [SUPERSEDING MIL-C-47113B]., This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.