MIL-DTL-47113E, DETAIL SPECIFICATION: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE (15 MAY 2012) [SUPERSEDING MIL-D-47113C]

MIL-DTL-47113E, DETAIL SPECIFICATION: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE (15 MAY 1012) [SUPERSEDING MIL-C-47113D]., Covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal. Heat Sink Compound are as follows: Type I - Silicone compound, Type II - Non-silicone compound