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MIL-DTL-47113C, DETAIL SPECIFICATION: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE (12 APR 1999) [SUPERSEDING MIL-C-47113B]

MIL-DTL-47113C, DETAIL SPECIFICATION: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE (12 APR 1999) [SUPERSEDING MIL-C-47113B]., This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.

MIL-DTL-47113 Rev. C

    

Version:
E05-201268.66 KB MIL-DTL-47113E
D09-200149.53 KB MIL-DTL-47113D
C04-1999319.77 KB MIL-DTL-47113C

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