MIL-PRF-31032/1C, PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, MULTILAYERED,THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (23 MAY 2010)

MIL-PRF-31032/1C, PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, MULTILAYERED,THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (23 MAY 2010)., The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-31032. This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, that will use soldering for component/part mounting.