RADC-TR-81-382, MICROCIRCUIT PACKAGE STRESS ANALYSIS (JAN-1982)

RADC-TR-81-382, MICROCIRCUIT PACKAGE STRESS ANALYSIS (JAN-1982)., he response of various package components to various stressful environments is studied. The environments selected are among those that the package might experience in the course of mechanical screening by the methods of MIL-STD-883 ("Test Methods and Procedures for Microelectronics") or they are approximations and idealizations of conditions that the package might encounter in the field.