MSFC-SPEC-411 (W/ AMENDMENT 1), SPECIFICATION: ADHESIVE, EPOXY RESIN (01 MAR 1966)

MSFC-SPEC-411 (W/ AMENDMENT 1), SPECIFICATION: ADHESIVE, EPOXY RESIN (01 MAR 1966)., This specification establishes the requirements for epoxy resin adhesives intended for structural bondings on printed circuit boards, components, and connectors.