MIL-PRF-31032/1C, PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING (23 MAY 2010

MIL-PRF-31032/1C, PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING (23 MAY 2010)., This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, that will use soldering for component/part mounting (see 6.1.1).