MIL-HDBK-525 (W/ CHANGE-1), DEPARTMENT OF DEFENSE HANDBOOK: ELECTRICAL WIRING INTERCONNECT SYSTEM (EWIS) INTEGRITY PROGRAM (24-MAR-2020)

MIL-HDBK-525 (W/ CHANGE-1), DEPARTMENT OF DEFENSE HANDBOOK: ELECTRICAL WIRING INTERCONNECT SYSTEM (EWIS) INTEGRITY PROGRAM (24-MAR-2020)., This handbook provides weapons systems program offices a systematic process to assess an aircraft Electrical Wiring Interconnect System (EWIS) for overall condition, service life extension, and continued airworthiness. It aligns with the Mechanical Equipment and Subsystems Integrity Program (MECSIP) (see MIL-STD-1798) and makes extensive use of lessons learned from EWIS-related military, industry, and Federal Aviation Administration (FAA) Advisory Circulars (ACs) concerned with maintaining aircraft airworthiness. It contains a framework to achieve and maintain the physical and functional integrity of the EWIS. This process should be tailored to meet specific platform, program office, system and/or subsystem requirements or constraints. The process and core tasks should also be tailored relative to platform status: whether in design, newly fielded, or based on years in sustainment. A program's use of this process should provide the information necessary to initiate the appropriate trades relative to the cost of modification or integrity initiatives versus required performance, maintenance and mission impact, total operating cost, and aircraft availability. This handbook is for guidance only and cannot be cited as a requirement