RADC-TR-67-106, INTERIM REPORT: RF BONDING STUDY (MAR-1967)

RADC-TR-67-106, INTERIM REPORT: RF BONDING STUDY (MAR-1967)., The significant factors affecting bonding impedance at high frequencies are examined and the reactance of the bonding structure is shown to be the major contributor. Resonant effects caused by stray capacitance are examined and an equivalent circuit is presented to explain the experimentally observed variation with frequency of the bonding impedance. Several techniques for the reduction of bonding impedance are described and experimentally evaluated. a. A technology for continuous visual display of bonding impedance versus frequency is presented and its suitability k for field use is noted.