MIL-STD-202/218 (W/ CHANGE-1), DEPARTMENT OF DEFENSE TEST METHOD STANDARD: METHOD 218, BOARD FLEX (19-SEP-2018)

MIL-STD-202/218 (W/ CHANGE-1), DEPARTMENT OF DEFENSE TEST METHOD STANDARD: METHOD 218, BOARD FLEX (19-SEP-2018)., This test is performed for verifying that the chip specimens can withstand bending loads that are likely to be applied during normal assembly or handling operations. This test is written for typical 2 terminal devices, mounting for other terminal configurations shall be specified in the individual specification.