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MIL-STD-202/215 (W/ CHANGE-1), DEPARTMENT OF DEFENSE TEST METHOD STANDARD: METHOD 215, RESISTANCE TO SOLVENTS (04-MAY-2018)

MIL-STD-202/215 (W/ CHANGE-1), DEPARTMENT OF DEFENSE TEST METHOD STANDARD: METHOD 215, RESISTANCE TO SOLVENTS (04-MAY-2018)., To verify that markings or color coding will not become illegible or discolored on the parts (including printed wiring boards) when subjected to solvents and processes normally used to clean solder flux, fingerprints, and other contaminants from printed-wiring and terminal-board assemblies, etc. To verify that component protective coatings and encapsulant materials are not degraded to the point where electrical or mechanical integrity is disturbed when subjected to solvents and processes normally used to clean solder flux, fingerprints, and other contaminants from printed wiring and terminal board assemblies, etc.

MIL-STD-202/215 Rev. CHG-1

    

Version:
CHG-105-201870.33 KB MIL-STD-202-215_CHG-1

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