EverySpec Standards
Home > Library > MIL-PRF > MIL-PRF-030000-79999 > MIL-PRF-31032-2B

MIL-PRF-31032/2B, PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING (14 JUN 2010)

MIL-PRF-31032/2B, PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING (14 JUN 2010)., This specification covers the generic performance requirements for rigid, single and double sided (1 or 2 conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes that will use soldering for component/part mounting (see 6.1.1).

MIL-PRF-31032/2 Rev. B

    

Version:
D03-2020393.34 KB MIL–PRF−31032_2D
B08-2010280.55 KB MIL-PRF-31032-2B

Simple Search
MilSpec Search



About Us   |   Terms of Use   |   DMCA   |   Privacy   |   EverySpec LLC © 2009 - 2024   All rights reserved.