A-A-56022, COMMERCIAL ITEM DESCRIPTION: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE (16 OCT 1992) [SUPERSEDING MIL-C-47113B]

A-A-56022, COMMERCIAL ITEM DESCRIPTION: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE (16 OCT 1992) [SUPERSEDING MIL-C-47113B]., This commercial item description covers a silicone and/or non-silicone and/or non-silicone heat sink compound which is applied to the base and mouning studs of transistors and diodes to provide a positive heat sink seal and improve thermal conductivity at heat sink junctions.